Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test
Haksan Jeong, Kyung Deuk Min, Choong-Jae Lee, Jae-Ha Kim, Seung‐Boo Jung
Topics & Concepts
SolderingThermal shockMaterials scienceFlip chipComposite materialMicrostructureInterconnectionSolderabilityMetallurgyLayer (electronics)Computer networkAdhesiveComputer scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties