Microstructural evolution and performance of high-tin-content Cu40Sn60 (wt. %) core/shell powder TLPS bonding joints
Xianwen Peng, Yue Wang, Zheng Ye, Jihua Huang, Jian Yang, Shuhai Chen, Xingke Zhao
Topics & Concepts
Materials scienceSinteringPorosityElectrical resistivity and conductivityComposite materialJoint (building)Shear strength (soil)MicrostructureTinCore (optical fiber)Phase (matter)Bonding strengthMetallurgySoil scienceArchitectural engineeringEngineeringSoil waterElectrical engineeringOrganic chemistryChemistryEnvironmental scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties