Surface action mechanism and design considerations for the mechanical integrity of cu/low K BEOL interconnect during chemical mechanical polishing process
Shizhao Wang, TianJian Liu, Fang Dong, Yameng Sun, Lianghao Xue, Rui Li, Xu Han, Zhiqiang Tian, Sheng Liu
Topics & Concepts
Chemical-mechanical planarizationMaterials scienceInterconnectionPolishingComposite materialStress (linguistics)Surface integrityReliability (semiconductor)Shear stressLayer (electronics)Delamination (geology)Mechanical engineeringSurface roughnessComputer scienceEngineeringPhilosophyPower (physics)Computer networkBiologyPaleontologyTectonicsLinguisticsSubductionPhysicsQuantum mechanicsAdvanced Surface Polishing TechniquesCopper Interconnects and ReliabilityMetal and Thin Film Mechanics