Self-standing boron nitride bulks enabled by liquid metals for thermal management
Li‐Chuan Jia, Zhixing Wang, Lei Wang, Jianfeng Zeng, Peiyao Du, Yun-Fei Yue, Lihua Zhao, Shenli Jia
Abstract
, which were among the highest values ever reported for TCMs. Furthermore, the LM@BN bulks exhibited superior compressive and leakage-free performances, with a high compressive strength (5.2 MPa) and without any LM leakage even after being crushed. It was also demonstrated that the excellent TCs of the LM@BN bulks made them effectively cool high-power light emitting diode modules. This work opens up one promising pathway for the development of high-performance TCMs for thermal management in the electronics industry.
Topics & Concepts
Boron nitrideMaterials scienceBoronNitrideThermalNanotechnologyThermal management of electronic devices and systemsChemical engineeringChemistryMechanical engineeringEngineeringOrganic chemistryPhysicsMeteorologyLayer (electronics)Thermal properties of materialsAdvanced ceramic materials synthesisGraphene research and applications