Non-destructive micro analysis of electromigration failures in solder microbumps using 3D X-ray computed tomography
Dinh-Phuc Tran, Tzu-Wen Lin, Kai-Cheng Shie, Chih Chen
Topics & Concepts
NeckingSolderingMaterials scienceElectromigrationVoid (composites)Coalescence (physics)NucleationScanning electron microscopeComposite materialX-rayMetallurgyOpticsAstrobiologyPhysicsChemistryOrganic chemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntegrated Circuits and Semiconductor Failure Analysis