An electro-thermo-mechanical coupling phase-field model of defect evolution induced by electromigration in interconnects
Xinwei Wu, Ming-Yang Chen, Liao-Liang Ke
Topics & Concepts
ElectromigrationMaterials scienceCoupling (piping)Phase (matter)Field (mathematics)MechanicsComposite materialPhysicsMathematicsQuantum mechanicsPure mathematicsElectronic Packaging and Soldering TechnologiesCopper Interconnects and ReliabilityAluminum Alloy Microstructure Properties