Quantifying the subsurface damage and residual stress in ground silicon wafer using laser ultrasonic technology: A Bayesian approach
Zaiwei Liu, Bin Lin, Xiaohu Liang, Anyao Du
Topics & Concepts
Residual stressMaterials scienceUltrasonic sensorAcousticsWaferMarkov chain Monte CarloOpticsMonte Carlo methodComposite materialOptoelectronicsPhysicsMathematicsStatisticsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationLaser Material Processing Techniques