Effect of mechanical properties and geometric dimensions on electromechanical impedance signatures for adhesive joint integrity monitoring
A. Francisco G. Tenreiro, António M. Lopes, Lucas F. M. da Silva, João Diogo Pereira Amorim
Abstract
Adhesive joints are prone to damage, which may be difficult to detect using Nondestructive Test. Structural Health Monitoring techniques, such as the Electromechanical Impedance Spectroscopy (EMIS), allow for continuous monitoring and early detection of structural defects. Developing efficient damage detection algorithms requires simulations of adhesive structures, which require elastic and damping properties under high frequency range. Tests were performed for crash-resistant and silicone adhesives. Numerical simulations with said properties were compared with experimental impedance measurements from Single Lap Joints (SLJ). This allowed for the estimation of adhesive properties, but numerical results for SLJs with silicone adhesive diverged from experimental results.