Optimizing dielectric, mechanical, and thermal properties of epoxy resin through molecular design for multifunctional performance
Yu‐Heng Deng, Y.W. Wong, Letitia Kai Yue Teh, Qi Wang, Wei-Feng Sun, Wen Kwang Chern, Joo Tien Oh, Zhong Chen
Abstract
, and a rise in tensile strength from 69.7 to 75.4 MPa. Other modifiers also show enhancements in dielectric, mechanical, thermal, and water uptake properties. Fourier-transform infrared spectroscopy (FTIR), scanning electron microscopy (SEM), and energy-dispersive X-ray spectroscopy (EDX) are employed to reveal the chemical structure of the modified epoxy resin and the distribution of modifiers. Results confirm successful grafting and exceptional dispersion without agglomeration. This study demonstrates that small amounts of chemical modifiers can significantly enhance epoxy resin performance. The resulting materials can meet the requirements for next-generation dielectric materials while maintaining low production costs.