Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding

Jhih-Jhu Jhan, Kazutoshi Wataya, Hiroshi Nishikawa, Chih‐Ming Chen

2021Journal of the Taiwan Institute of Chemical Engineers55 citationsDOI

Topics & Concepts

Nanocrystalline materialMaterials scienceDirect bondingDiffusion bondingAtomic diffusionThermocompression bondingCopperShear strength (soil)Anodic bondingGrain sizeBond strengthDiffusionGrain boundaryMetallurgyMicrostructureComposite materialCrystallographyNanotechnologyLayer (electronics)ChemistrySiliconAdhesivePhysicsThermodynamicsEnvironmental scienceSoil waterSoil science3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability