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Nanotwinned copper micro-cone array fabricated by pulse electrodeposition for low-temperature bonding

Mengya Dong, Peixin Chen, Tao Hang, Ming Li

2021Materials Letters19 citationsDOI

Topics & Concepts

Materials scienceCopperTransmission electron microscopyScanning electron microscopeCrystal twinningElectrolyteFabricationComposite materialNanotechnologyMetallurgyElectrodeMicrostructureMedicinePathologyAlternative medicinePhysical chemistryChemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesElectrodeposition and Electroless Coatings
Nanotwinned copper micro-cone array fabricated by pulse electrodeposition for low-temperature bonding | Litcius