Damage detection technique using ultrasonic guided waves and outlier detection: Application to interface delamination diagnosis of integrated circuit package
Hyunseong Lee, Bonsung Koo, Aditi Chattopadhyay, Rajesh Kumar Neerukatti, Kuang C. Liu
Topics & Concepts
Delamination (geology)Ultrasonic sensorCluster analysisMaterials scienceComputer scienceElectronic engineeringAcousticsPattern recognition (psychology)Artificial intelligenceEngineeringSubductionTectonicsPaleontologyPhysicsBiologyIndustrial Vision Systems and Defect DetectionIntegrated Circuits and Semiconductor Failure AnalysisUltrasonics and Acoustic Wave Propagation