Development of Y2O3 dispersion strengthened Cu alloy using Cu6Y and Cu2O addition through the MA-HIP process
Bing Ma, Yoshimitsu Hishinuma, Hiroyuki Noto, Yusuke Shimada, T. Muroga
Topics & Concepts
Materials scienceHot isostatic pressingAlloyYttriumIntermetallicOxideThermal conductivityCopperNano-Grain boundaryComposite materialMetallurgyMicrostructureFusion materials and technologiesNuclear Materials and PropertiesHigh-Temperature Coating Behaviors