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Understanding and mitigating temperature-induced agglomeration in silica-based chemical mechanical planarization (CMP) slurry storage

Ali Othman, Hong Jin Kim, Rahul Trivedi, Thayalan Kulasingam, Jihoon Seo

2024Colloids and Surfaces A Physicochemical and Engineering Aspects14 citationsDOI

Topics & Concepts

Chemical-mechanical planarizationSlurryEconomies of agglomerationMaterials scienceNanotechnologyChemical engineeringComposite materialLayer (electronics)EngineeringAdvanced Surface Polishing TechniquesInnovations in Concrete and Construction MaterialsAdvanced Cellulose Research Studies
Understanding and mitigating temperature-induced agglomeration in silica-based chemical mechanical planarization (CMP) slurry storage | Litcius