Improvement of performance stability of electrolytic copper foils by bi-component additives
Yue Sun, Jianfeng Pan, Lingling Liu, Youtong Fang, Gaorong Han, Jiabin Liu
Topics & Concepts
CopperMaterials scienceElectrochemistryUltimate tensile strengthCopper platingElectrolyteSurface roughnessChemical engineeringComposite materialMetallurgyElectrodeElectroplatingChemistryPhysical chemistryEngineeringLayer (electronics)Electrodeposition and Electroless CoatingsCorrosion Behavior and InhibitionNanomaterials and Printing Technologies