Damage based PoF model of solder joints under temperature cycling and electric coupling condition
Jiaxin Yuan, Sujuan Zhang, Bo Wan, Guicui Fu, Maogong Jiang
Topics & Concepts
CreepSolderingTemperature cyclingDissipationMaterials scienceCoupling (piping)PlasticityNonlinear systemConstitutive equationStructural engineeringThermalMechanicsComposite materialEngineeringFinite element methodPhysicsThermodynamicsQuantum mechanicsElectronic Packaging and Soldering TechnologiesHigh Temperature Alloys and CreepFatigue and fracture mechanics