Investigation of thermal effects in copper chemical mechanical polishing
Pengzhan Liu, Sung-Hoon Bae, Seok‐Jun Hong, Chulwoo Bae, Hyeonmin Seo, Jungryul Lee, Cheng Tang, Taesung Kim
Topics & Concepts
Chemical-mechanical planarizationPolishingWaferSlurryMaterials scienceCopperParticle (ecology)MetallurgyThermalSemiconductor device fabricationComposite materialNanotechnologyMeteorologyGeologyPhysicsOceanographyAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced ceramic materials synthesis