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Charge Control in Schottky-Type p-GaN Gate HEMTs With Partially and Fully Depleted p-GaN Conditions

Qianshu Wu, Jia Chen, Liang He, Jinwei Zhang, Qiuling Qiu, Chenliang Feng, Liuan Li, Taotao Que, Zhenxing Liu, Zhisheng Wu, Zhiyuan He, Yang Liu

2022IEEE Transactions on Electron Devices15 citationsDOI

Abstract

The Schotty-type p-GaN gate high-electron-mobility transistors (HEMT) feature a unique gate structure. A comprehensive understanding of the charge control mechanism in the p-GaN gate region is a fundamental step for the optimization of this technology. In this work, a physics-based analytical model is presented which takes into consideration all the capacitive effects from gate metal deep into the GaN buffer. According to our analysis, the p-GaN layer can be either partially depleted by the metal/p-GaN Schottky junction or fully depleted, depending on the doping concentration and thickness of the p-GaN layer. Our model accurately captures the charge control properties under both conditions and is validated against TCAD numerical simulations. For a certain p-GaN thickness, a lightly doped p-GaN leads to a full-depletion condition, such that the acceptor concentration directly affects the band diagram at AlGaN/GaN interface. The <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{\text {th}}$ </tex-math></inline-formula> of the HEMT increases quickly with acceptor concentration in p-GaN. With sufficiently high acceptor concentration in p-GaN, the device reaches the partial-depletion condition, the acceptor concentration loses its influence over the band diagram at the location of the AlGaN/GaN interface, since the Fermi-level at the AlGaN surface is pinned near the valence band of p-GaN. The <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{\text {th}}$ </tex-math></inline-formula> starts to decrease with acceptor concentration, but at a relatively slow rate. The maximum <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{\text {th}}$ </tex-math></inline-formula> is obtained near the boundary between partial-and full-depletion conditions. In consideration of the process margin, the device designed with a partially depleted p-GaN is preferable, since it ameliorated the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{\text {th}}$ </tex-math></inline-formula> sensibility against acceptor concentration.

Topics & Concepts

High-electron-mobility transistorCharge controlMaterials scienceOptoelectronicsBand diagramAcceptorDopingGallium nitrideSchottky barrierTransistorSchottky diodeTopology (electrical circuits)HeterojunctionCondensed matter physicsLayer (electronics)Electrical engineeringPhysicsVoltageNanotechnologyQuantum mechanicsPower (physics)EngineeringBattery (electricity)DiodeGaN-based semiconductor devices and materialsGa2O3 and related materialsSilicon Carbide Semiconductor Technologies
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