Effect of processing conditions on residual stress in sputtered transition metal nitrides (TiN, ZrN and TaN): Experiments and modeling
Zhaoxia Rao, Tong Su, Thomas R. Koenig, Gregory B. Thompson, Diederik Depla, Eric Chason
Topics & Concepts
Materials scienceTinCompressive strengthStress (linguistics)Residual stressComposite materialFlow stressNitrideUltimate tensile strengthSputteringMetallurgyStrain rateThin filmNanotechnologyLayer (electronics)LinguisticsPhilosophyMetal and Thin Film MechanicsSemiconductor materials and devicesCopper Interconnects and Reliability