High efficient personal thermoregulatory device: Metallized interface layer between flexible polyimide substrate and foam copper heat sink enables thermal resistance reduction
Junhao Li, Dongwang Yang, Jianan Lyu, Yutian Liu, Yuting Wang, Zinan Zhang, Yu Zheng, Yongzhong Jia, Ziao Wang, Zhicheng Pan, Bachir Melzi, Yonggao Yan, Xinfeng Tang
Topics & Concepts
PolyimideMaterials scienceThermal resistanceHeat sinkComposite materialLayer (electronics)ThermalCopperHeat resistanceSubstrate (aquarium)OptoelectronicsElectrical engineeringMetallurgyEngineeringThermodynamicsGeologyPhysicsOceanographyAdvanced Thermoelectric Materials and DevicesThermal Radiation and Cooling TechnologiesThermal properties of materials