Structural effect of inhibitors on adsorption and desorption behaviors during copper electroplating for through-silicon vias
Mengya Dong, Yumei Zhang, Tao Hang, Ming Li
Topics & Concepts
DesorptionElectroplatingEthylene glycolAdsorptionPEG ratioCopperElectrochemistryChemical engineeringEthylenediamineSiliconPoloxamerMaterials scienceChemistryInorganic chemistryNanotechnologyPolymerOrganic chemistryElectrodePhysical chemistryCopolymerLayer (electronics)FinanceEconomicsEngineeringElectrodeposition and Electroless CoatingsSemiconductor materials and interfacesElectronic Packaging and Soldering Technologies