Effect of indium on microstructure, mechanical properties, phase stability and atomic diffusion of Sn-0.7Cu solder: Experiments and first-principles calculations
Ancang Yang, Kunxuan Xiao, Yonghua Duan, Caiju Li, Jianhong Yi, Mingjun Peng, Li Shen
Topics & Concepts
IntermetallicMaterials scienceIndiumSolderingMicrostructureMelting pointUltimate tensile strengthAlloyDopingDiffusionAtomic diffusionTernary operationLattice diffusion coefficientMetallurgyGalliumComposite materialCrystallographyThermodynamicsChemistryEffective diffusion coefficientOptoelectronicsPhysicsProgramming languageMagnetic resonance imagingRadiologyMedicineComputer scienceElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisIntermetallics and Advanced Alloy Properties