Plasma-activated silicon–glass high-strength multistep bonding for low-temperature vacuum packaging
Mingzhi Yu, Libo Zhao, Yongliang Wang, Yong Xia, Yintao Ma, Yanbin Wang, Xiangguang Han, Yao Chen, Shun Lu, Guoxi Luo, Nan Zhu, Ping Yang, Kaifei Wang, Qijing Lin, Zhuangde Jiang, Qijing Lin, Zhuangde Jiang
Topics & Concepts
Anodic bondingPlasma activationMaterials scienceWafer bondingThermocompression bondingWaferComposite materialDirect bondingSurface energySiliconPlasmaNanotechnologyMetallurgyLayer (electronics)Quantum mechanicsPhysics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdvanced MEMS and NEMS Technologies