Distribution optimization of thermal through-silicon via for 3D chip based on thermal-mechanic coupling
Xiaonan Guan, Kun Xi, Zhihui Xie, Jian Zhang, Zhuoqun Lu, Yanlin Ge
Topics & Concepts
ThermalCoupling (piping)Materials scienceRotation (mathematics)Volume (thermodynamics)Enhanced Data Rates for GSM EvolutionSiliconMechanicsChipStress (linguistics)Optimal designStructural engineeringComposite materialThermodynamicsEngineeringOptoelectronicsPhysicsElectrical engineeringGeometryMathematicsTelecommunicationsLinguisticsStatisticsPhilosophy3D IC and TSV technologiesSilicon and Solar Cell TechnologiesElectronic Packaging and Soldering Technologies