Litcius/Paper detail

Dynamic compression of dendritic high-entropy alloy <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" altimg="si15.svg" display="inline" id="d1e674"><mml:mrow><mml:msub><mml:mrow><mml:mi mathvariant="normal">Al</mml:mi></mml:mrow><mml:mrow><mml:mn>0</mml:mn><mml:mo>.</mml:mo><mml:mn>5</mml:mn></mml:mrow></mml:msub><mml:mi mathvariant="normal">CoCrFeNi</mml:mi></mml:mrow></mml:math> with various microstructures: Experiments and constitutive modeling

C.K. Wan, J.C. Yuan, L.X. Li, Y. Cai, Yao Shi, Qiancheng Liu, Liang Lü, N.B. Zhang, Sheng‐Nian Luo

2025Materials Science and Engineering A20 citationsDOI

Topics & Concepts

Computer scienceComputer graphics (images)High Entropy Alloys StudiesHigh-Temperature Coating BehaviorsAdditive Manufacturing Materials and Processes