Microstructural Coarsening and Mechanical Properties of Eutectic Sn-58Bi Solder Joint During Aging
Fengjiang Wang, Amey Luktuke, Nikhilesh Chawla
Topics & Concepts
Eutectic systemNanoindentationSolderingMaterials scienceMetallurgyMelting pointMicrostructureDissolutionIntermetallicComposite materialAlloyChemistryPhysical chemistryElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy Properties3D IC and TSV technologies