Litcius/Paper detail

A peridynamic thermal contact model for heat conduction analysis of thermally imperfect interface and conductive crack

Heng Zhang, Dan Huang, Yong Zhang

2025International Journal of Heat and Mass Transfer15 citationsDOI

Topics & Concepts

Materials scienceThermal conductionElectrical conductorInterface (matter)Thermal contactThermalComposite materialThermal contact conductanceImperfectMechanicsHeat transferThermal resistanceContact angleThermodynamicsSessile drop techniquePhysicsLinguisticsPhilosophyNumerical methods in engineeringGeotechnical Engineering and Underground StructuresFatigue and fracture mechanics