The curing kinetics and mechanical properties of epoxy resin composites reinforced by PEEK microparticles
Ting Zheng, Hang Xi, Zixuan Wang, Xiaohong Zhang, Yuan Wang, Yingjie Qiao, Peng Wang, Qiuwu Li, Zhuona Li, Cheng Ji, Xiaodong Wang
Topics & Concepts
Materials sciencePeekEpoxyComposite materialCuring (chemistry)Differential scanning calorimetryUltimate tensile strengthAutocatalysisThermosetting polymerFlexural strengthFlexural modulusComposite numberPolyether ether ketoneDynamic mechanical analysisKineticsPolymerPhysicsQuantum mechanicsThermodynamicsEpoxy Resin Curing ProcessesPolymer crystallization and propertiesPolymer Nanocomposites and Properties