Litcius/Paper detail

Wireless photoelectrochemical mechanical polishing for inert compound semiconductor wafers

Liqing Qiao, Liwei Ou, Kang Shi

2023Journal of Manufacturing Processes14 citationsDOI

Topics & Concepts

PolishingWaferMaterials scienceChemical-mechanical planarizationSemiconductorOptoelectronicsComposite materialAdvanced Surface Polishing TechniquesSemiconductor materials and devicesElectronic and Structural Properties of Oxides
Wireless photoelectrochemical mechanical polishing for inert compound semiconductor wafers | Litcius