Enhancement of cooling performance in MEMS by modifying 3D packaging structure: A design, integration, analysis and test study
Rong Li, Zhanbin Wu, Ziyue Wang, Lihua He, Ming Xiong, Tingting Liu, Min Kong, Ban Wang, Juyong Zhang
Topics & Concepts
Passive coolingMechanical engineeringMicroelectromechanical systemsEnergy consumptionComputer coolingHeat sinkWater coolingOverlayProcess engineeringEngineeringAutomotive engineeringMaterials scienceThermalThermal management of electronic devices and systemsComputer scienceElectrical engineeringNanotechnologyProgramming languagePhysicsMeteorologyHeat Transfer and Optimization3D IC and TSV technologiesElectronic Packaging and Soldering Technologies