High-strength joining of silica glass and 2024 aluminum alloy by ultrasonic-assisted soldering with Sn-Bi low temperature solder
Xiaolei Gao, Chao Chen
Topics & Concepts
Materials scienceSolderingComposite materialJoint (building)MetallurgyShear strength (soil)Composite numberAlloyShearing (physics)Ultrasonic sensorPhysicsSoil waterEngineeringEnvironmental scienceSoil scienceAcousticsArchitectural engineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties