Deep insights into interaction behaviour and material removal of β-SiC wafer in nanoscale polishing
Tan-Tai Do, Te‐Hua Fang
Topics & Concepts
PolishingAbrasiveMaterials scienceWaferSilicon carbideVibrationSurface roughnessChemical-mechanical planarizationOscillation (cell signaling)Root mean squareSurface finishGrindingComposite materialAmplitudeOpticsAcousticsNanotechnologyEngineeringPhysicsBiologyGeneticsElectrical engineeringAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchForce Microscopy Techniques and Applications