The combined impact of voids and thermal aging on the mechanical reliability of epoxy resin evaluated by statistical analysis
Yu‐Heng Deng, Qi Wang, Jielin Ma, Joo Tien Oh, Zhong Chen
Topics & Concepts
Materials scienceEpoxyVoid (composites)Composite materialUltimate tensile strengthWeibull distributionPorosityFourier transform infrared spectroscopyScanning electron microscopeTensile testingThermal shockMathematicsPhysicsStatisticsQuantum mechanicsHigh voltage insulation and dielectric phenomenaDielectric materials and actuatorsEpoxy Resin Curing Processes