Physics-based simulation of stress-induced and electromigration-induced voiding and their interactions in on-chip interconnects
Armen Kteyan, Valeriy Sukharev
Topics & Concepts
ElectromigrationInterconnectionVoid (composites)ChipFinite element methodStress (linguistics)Materials scienceMechanicsElectronic engineeringPhysicsComputer scienceComposite materialEngineeringElectrical engineeringThermodynamicsComputer networkLinguisticsPhilosophyCopper Interconnects and ReliabilityElectronic Packaging and Soldering TechnologiesSemiconductor materials and devices