Electrodeposition of nano-diamond/copper composite platings: Improved interfacial adhesion between diamond and copper via formation of silicon carbide on diamond surface
Takeshi Hagio, Jae‐Hyeok Park, Yuto Naruse, Yasuki Goto, Yuki Kamimoto, Ryoichi Ichino, Takeshi Bessho
Topics & Concepts
DiamondCopperMaterials scienceThermal conductivityMetallurgyComposite materialComposite numberCopper platingSilicon carbideElectroplatingLayer (electronics)Diamond and Carbon-based Materials ResearchAluminum Alloys Composites PropertiesMetal and Thin Film Mechanics