Implementation of Epoxy Resin Composites Filled with Copper Nanowire-Modified Boron Nitride Nanosheets for Electronic Device Packaging
Yinjun Shi, Yushun Zhao, Tianqi Hou, Chengcheng Liao, Dengyun Li
Abstract
The introduction of wide-band semiconductor devices has led to the development of electronic components with a high degree of integration and power density. The use of dielectric polymers can guarantee the performance of electronic components while maximizing their operational reliability. However, this polymer performance is often enhanced at the expense of its electrical insulation properties and processability. Herein, we report the synthesis of epoxy resin composites filled with boron nitride nanosheets (BNNSs) functionalized with copper nanowires (Cu NWs). Through encapsulation within a polydopamine coating, Cu NWs and BNNSs exhibit excellent electrical insulation properties and high dispersion, and their 1D and 2D interconnected networks enable effective charge and heat transfer. Hence, these epoxy resin composites showed a thermal conductivity of 1.2 W/m K at a filler loading rate of 26 wt %, marking a staggering 486% increase compared to pure epoxy resin. These composites also showed low dielectric loss, enhanced electrical insulation properties, matched thermal expansion coefficients, and low water absorption. Experimental analyses and simulations indicated that the composites had strong heat dissipation capability, meeting the technical specifications for electronic packaging materials, and are thus expected to find use in electronic device packaging.