Electromigration enhanced growth kinetics of intermetallics at the Cu/Al interface
Junqi Shao, Shenghua Deng, Hongjin Zhao, Lihao Lou, Bao‐Sen Shi, Lvzhou Chen, Liang Xu
Topics & Concepts
ElectromigrationIntermetallicJoule heatingMaterials scienceThermodynamicsKineticsCurrent (fluid)Kinetic energyGrowth rateReaction rate constantCurrent densityLayer (electronics)ThermalMetallurgyAnalytical Chemistry (journal)Composite materialChemistryChromatographyPhysicsAlloyGeometryQuantum mechanicsMathematicsElectronic Packaging and Soldering TechnologiesCopper Interconnects and ReliabilityIntermetallics and Advanced Alloy Properties