The differences in bonding properties and electrical, thermal conductivity between the preferred crystallographic orientation interface of Cu3Sn/Cu
Jieshi Chen, Xiao He, Zhixin Hou, Xinyu Wang, Xuerong Shi, Xin Ye, Hao Lü, Kai Xiong, Shuye Zhang
Topics & Concepts
Materials scienceCovalent bondThermoelectric effectInterface (matter)Ionic bondingDensity functional theoryThermal conductivityThermal stabilityCrystallographyOrientation (vector space)Condensed matter physicsThermodynamicsChemical engineeringComputational chemistryComposite materialIonCapillary numberCapillary actionEngineeringPhysicsChemistryQuantum mechanicsGeometryMathematicsAdvanced Thermoelectric Materials and DevicesThermal properties of materialsMachine Learning in Materials Science