Investigation of mechanical force acting on the surface modified-substrate layer area during the chemical-mechanical micro-grinding of monocrystalline silicon
Wei Li, Yi Jiao, Haiyang Jiang, Yinghui Ren, Ahmed Mohamed Mahmoud Ibrahim
Topics & Concepts
Monocrystalline siliconMaterials scienceSiliconGrindingSubstrate (aquarium)NanoindentationLayer (electronics)Composite materialOptoelectronicsGeologyOceanographyAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationLaser Material Processing Techniques