Significant enhancement of the overall performance of SAC joints by adding Cu@Sn@Ag core shell particles and ultrasonically assisted soldering
Jinghui Fan, Minming Zou, Sifan Tan, Guangyu Zhu, Langfeng Zhu, Bing Fu, Chao Qiang, Zhixiang Wu, Wenjing Chen, Xiaowu Hu, Tao Xu, Xiongxin Jiang
Topics & Concepts
Materials scienceSolderingShell (structure)Core (optical fiber)Composite materialMetallurgyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability