Influence of anisotropy on material removal and deformation mechanism based on nanoscratch tests of monocrystal silicon
Hongfei Tao, Qinyang Zeng, Yuanhang Liu, Dewen Zhao, Xinchun Lu
Topics & Concepts
Materials scienceMonocrystalline siliconSiliconComposite materialAnisotropyMachiningDeformation (meteorology)Chip formationBrittlenessDeformation mechanismScratchTool wearOptoelectronicsMicrostructureOpticsMetallurgyPhysicsAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchIntegrated Circuits and Semiconductor Failure Analysis