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Insights into the atomic scale structure, bond characteristics and wetting behavior of Cu(001)/Cu6Sn5(110) interface: A first-principles investigation

Wenchao Yang, Jingwu Wu, Mingjun Pang, Yongzhong Zhan

2021Vacuum25 citationsDOI

Topics & Concepts

WettingCovalent bondSurface energyMaterials scienceAdhesionAtomic unitsMulliken population analysisInterface (matter)CrystallographyMolecular physicsChemistryAtomic physicsDensity functional theoryComputational chemistryComposite materialPhysicsSessile drop techniqueOrganic chemistryQuantum mechanicsElectronic Packaging and Soldering TechnologiesSemiconductor materials and devicesZnO doping and properties
Insights into the atomic scale structure, bond characteristics and wetting behavior of Cu(001)/Cu6Sn5(110) interface: A first-principles investigation | Litcius