Enhancing the high-frequency signal performance through surface morphological modification of Cu interconnects
Ying-Chih Chiang, Yu‐Hsun Chang, Z. C. Yang, Chun-Jou Yu, Wei-Ling Chou, Cheng–En Ho
Topics & Concepts
SIGNAL (programming language)Materials scienceSurface (topology)AcousticsElectronic engineeringComputer scienceEngineeringPhysicsMathematicsGeometryProgramming language3D IC and TSV technologiesAdvanced Antenna and Metasurface TechnologiesElectromagnetic Compatibility and Noise Suppression