Reactivity with tin and corrosion resistance of electroless Ni-P and Ni-P-Re coatings plated on copper
Joanna Wojewoda-Budka, Anna Wierzbicka-Miernik, Izabella Kwiecień, Fabrizio Valenza, Anna Korneva, Marta Janusz-Skuza, Katarzyna Stan-Głowińska, J. Guśpiel, Monika Bugajska
Topics & Concepts
Materials scienceCoatingMetallurgySolderingTinIntermetallicLayer (electronics)CopperAmorphous solidChemical engineeringAlloyComposite materialChemistryEngineeringOrganic chemistryElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesSemiconductor materials and interfaces