A phase field computational procedure for electromigration with specified contact angle and diffusional anisotropy
Subramanya Sadasiva, Pavan Kumar Vaitheeswaran, Ganesh Subbarayan
Topics & Concepts
ElectromigrationAnisotropyMaterials scienceThermal diffusivityVoid (composites)SolderingCondensed matter physicsNucleationContact angleCathodeCurrent densityComposite materialMechanicsOpticsThermodynamicsElectrical engineeringEngineeringPhysicsQuantum mechanicsSolidification and crystal growth phenomenaAluminum Alloy Microstructure PropertiesElectronic Packaging and Soldering Technologies