Parametric study of thermally induced warpage of FpBGA package using finite element methods
Y. Venkata Naga Chandana, Nathi Venu Kumar
Topics & Concepts
Finite element methodBall grid arrayMaterials scienceElectronic packagingPackage on packageDesign for manufacturabilityParametric statisticsOriented strand boardStructural engineeringMaterial propertiesMechanical engineeringQuad Flat No-leads packageChip-scale packageThermal expansionComposite materialEngineeringSolderingMathematicsWaferLayer (electronics)AdhesiveWafer dicingStatisticsNanotechnologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdditive Manufacturing and 3D Printing Technologies