Thermally assisted nanotransfer printing with sub–20-nm resolution and 8-inch wafer scalability
Tae Wan Park, Myunghwan Byun, Hyunsung Jung, Gyu Rac Lee, Jae Hong Park, Hyun-Ik Jang, Jung Woo Lee, Se‐Hun Kwon, Seungbum Hong, Jong‐Heun Lee, Yeon Sik Jung, Kwang Ho Kim, Woon Ik Park
Abstract
Nanotransfer printing (nTP) has attracted considerable attention due to its good pattern resolution, process simplicity, and cost-effectiveness. However, the development of a large-area nTP process has been hampered by critical reliability issues related to the uniform replication and regular transfer printing of functional nanomaterials. Here, we present a very practical thermally assisted nanotransfer printing (T-nTP) process that can easily produce well-ordered nanostructures on an 8-inch wafer via the use of a heat-rolling press system that provides both uniform pressure and heat. We also demonstrate various complex pattern geometries, such as wave, square, nut, zigzag, and elliptical nanostructures, on diverse substrates via T-nTP. Furthermore, we demonstrate how to obtain a high-density crossbar metal-insulator-metal memristive array using a combined method of T-nTP and directed self-assembly. We expect that the state-of-the-art T-nTP process presented here combined with other emerging patterning techniques will be especially useful for the large-area nanofabrication of various devices.