A New Press Pack IGBT for High Reliable Applications With Short Circuit Failure Mode
Heng Wang
Abstract
The modular multilevel converter (MMC or M2C) technology becomes the mainstream solution in today's voltage source converter-high voltage direct current (VSC-HVDC) transmission lines because of its unique performance. Recently press pack IGBT (PPI) has come into focus as a preferred realization for high power rating VSC-HVDC stations, it could offer the highest current rating IGBTs and advanced features in reliability. A new PPI is introduced in this paper, which is designed for several innovative improvements based on the application demands from VSC-HVDC systems. The chip is optimized for low on-state voltage with advanced trench technology, and well protected in a chip-stack by double side sinter process. The disc package is designed with hermetic sealed ceramic housing to avoid environmental erosion and could provide a robust feature of short circuit failure mode (SCFM), which is fully qualified under the worst-case scenario. In addition to the PPI device, system solutions had also been developed and investigated to support field developments, including electrical and mechanical design. An example of a power stack is analyzed in commutation loop, pressure distribution, and power losses.