Cross-scale numerical analysis of PCB lamination process by an innovative partitioned homogenization method for the non-uniform curing shrinkage effect
Guoshun Wan, Qi Dong, Xiaochen Sun, Hao Zheng, Mengxuan Cheng, Zhiyan Zhao, Yuxi Jia
Topics & Concepts
ShrinkageHomogenization (climate)LaminationCuring (chemistry)Composite materialMaterials scienceLayer (electronics)BiodiversityBiologyEcologyMaterial Properties and ProcessingElectronic Packaging and Soldering TechnologiesMechanical Behavior of Composites