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Mechanical properties and microstructure evolution of T2 copper in multimodal ultrasonic vibration assisted micro-compression

Weiqiang Wan, Zidong Yin, Guangchao Han, Ming Yang, Jitao Hu, Fuchu Liu, Linhong Xu, Wei Bai, Hui Chen

2024Journal of Material Science and Technology10 citationsDOI

Topics & Concepts

MicrostructureMaterials scienceCopperCompression (physics)Ultrasonic sensorComposite materialVibrationMetallurgyAcousticsPhysicsMicrostructure and mechanical propertiesMetal Forming Simulation TechniquesMetallurgy and Material Forming
Mechanical properties and microstructure evolution of T2 copper in multimodal ultrasonic vibration assisted micro-compression | Litcius